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Non-Equilibrium Molecular Dynamics Simulation of Electromigration in Aluminum-Based Metallic Interconnects
Electromigration Diffusion Non-equilibrium molecular dynamics
2009/10/9
The effect of alloying elements in aluminum on diffusion behavior was investigated using non-equilibrium molecular dynamics (NEMD) under the effect of electromigration wind force. The electromigration...
期刊信息
篇名
Diluting and Annealing Effects on Electromigration and Morphology of Chemical Vapor Deposited Copper Films
语种
英文
撰写或编译
撰写
作者
Song Wu,Xiao-Feng Li,Xin Liu,Qi Wang（王琦*）
第一作者单位
浙江大学化学系
刊物名称
Vacuu...
Comparative Study of Statistical Distributions in Electromigration-Induced Failures of Al/Cu Thin-Film Interconnects
Statistical Distributions Electromigration-Induced Failures Al/Cu Thin-Film Interconnects
2010/12/15
In electromigration failure studies, it is in general assumed that electromigration-induced failures may be adequately modelled by a log-normal distribution. Further to this, it has been argued that a...