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Academy of Mathematics and Systems Science, CAS Colloquia & Seminars：Advanced Multiphysics Methods for 3-D Integrated Circuits
三维 集成电路 高级 多物理方法
2023/5/18
In recent years, integrated circuit (IC) industry has developed rapidly. As the frequency of integrated circuits increasing, electromagnetic interference, thermal effect and mechanical effect from chi...
SURVEY METHODS FOR SEISMIC VULNERABILITY ASSESSMENT OF HISTORICAL MASONRY BUILDINGS
Earthquake Laser scanner Cultural Heritage Camera degli Sposi Mantegna
2017/6/20
On 20th and 29th of May 2012, two powerful earthquakes struck northern Italy. The epicentres were recorded respectively in Finale Emilia (magnitude 5.9 Ml) and Medolla (magnitude 5.8 Ml) in the provin...
Functional Verification of Arithmetic Circuits using Linear Algebra Methods
Functional Verification Arithmetic Circuits Linear Algebra SMT Arithmetic bit-level Equivalence checking
2014/12/8
This thesis describes an efficient method for speeding up functional verification of arithmetic circuits namely linear network such as wallace trees, counters using linear algebra techniques. The circ...
The Measurement of Internal Temperature Anomalies in the Body Using Microwave Radiometry and Anatomical Information: Inference Methods and Error Models
Microwave Radiometry Temperature Anomaly Detection Medical
2014/12/8
The ability to observe temperature variations inside the human body may help in detecting the presence of medical anomalies. Abnormal changes in physiological parameters (such as metabolic and blood p...
Robust and Scalable Domain Decomposition Methods for Electromagnetic Computations
domain decomposition electromagnetics FETI finite element method LEAP Maxwell equations
2014/11/7
The Finite Element Tearing and Interconnecting (FETI) and its variants are probably the most celebrated domain decomposition algorithms for partial differential equation (PDE) scientific computations....
Usage of Sims and Auger Test Methods in the Production of Multilayer Printed Circuit Boards
Sims and Auger Test Methods Multilayer Printed Circuit Boards
2010/12/23
The quality and reliability of multilayer boards are determined by the adhesion strength between the copper sheets and the epoxy-glass laminates. The adhesion properties of copper foil may be improved...
Quality and reliability requirements have been boosted by the general use of complex integrated circuits. An economical and high quality production is preconditioned by the continuous checking of prim...
Inaccuracies of Measuring Methods and Their Influence on the Regression Function
the Regression Function electronic components the materials
2010/12/23
The quality parameters of electronic components and devices usually depend on the parameters of the materials. In many cases one does not know the theoretical relationship between the parameters, and ...
Reliability Assessment and Screening by Reliability Indicator Methods
Reliability Indicator Methods Built-in flaws electronic components
2010/12/23
Built-in flaws in electronic components have been recognized as a serious cause of failure. They are difficult to screen away by conventional methods because the times-to-failures for component workin...
Wire Laying Methods as an Alternative to Multilayer PCB's
Wire Laying Methods Multilayer PCB's
2010/12/23
The rapid growth of integrated circuit technology, culminating in VLSI circuits, is responsible for the proliferation of new, surface mountable device packages with large numbers of input-output termi...